42 Projects Signed in Shanghai
The signing ceremony for 42 major projects was held in Lingang New Area, Shanghai on August 17. The total investment reached approximately 28 billion yuan, covering various areas such as integrated circuits, high-end equipment manufacturing, and more.
Shanghai Willsemi’s headquarters and research center project is one of the signed projects. The project will build research centers for CMOS image sensors, analog chips, touch and display chips, and cross-border trade centers.
Another project signed is Shangai HestiaPower Technology Co, Ltd.’s SiC industrial base project. This project will develop SiC components and modules, testing, and manufacturing of SiC products. Shanghai HestiaPower is a high-tech enterprise committed to researching and production of the third-generation wide band gap semiconductor power devices and power modules. It is a domestic company that can mass produce vehicle-level SiC MOS tubes and diodes.
Lingang New Area focuses on developing the integrated circuit industry in recent years. More than 100 companies have located here with a total investment of 150 billion yuan.
New Semiconductor Advanced Packaging Carrier Project Signed in Wuzhen
Tongxiang, Jiaxing City, Zhejiang recently held a signing ceremony for several major semiconductor-related projects. Among the signed projects is a new semiconductor advanced packaging carrier project.
The planned total investment of the project will be 2 billion yuan. It will include the research, manufacture, and sales of integrated circuit packaging carriers. The products will include IC carriers, ceramic substrates, high precision double boards and multi-layer boards, etc. These products can be widely used in industries such as power components and communication, mobile phone application modules, automotive electronics, laser chip packaging, LED packaging, etc.
Shenzhen HonedChip’s IC Research Project Signed in Hanzhong High-Tech Zone
Hanzhong High-Tech Zone, Shaanxi Province signed an agreement Shenzhen HonedChip Semiconductor Co., Ltd. for its integrated circuit research project with a total investment of 22 million yuan.
It’s reported that the project will be built in two phases over three years. It’s expected that the project will apply for at least 10 national invention patents within three years.
Established in May 2018, Shenzhen HonedChip Semiconductor Co., Ltd. focuses on integrated circuit design, layout design, and chip analysis services. Its long-term partners include ZTE, UNI Group, Chinese Academy of Sciences, etc.
41 Projects Signed in Chongqing Science City
The online signing ceremony of Western (Chongqing) Science City was held recently in the Chongqing High-Tech Zone. There were 41 projects signed during the ceremony, with a total investment of 41.7 billion yuan. 4 advanced manufacturing projects are included representing a total investment of 3.9 billion yuan.
Xinhe Qiyue’s vertical graphene electrocatalysis product industrialization project is one of the signed projects, with investment of 254 million yuan from Chongqing Xinhe Qiyue Technology Co. Ltd.
Chongqing Xinhe Qiyue Technology Co. Ltd. is a high-tech enterprise focusing on the research and production of vertical graphene and its products. The company utilizes world-leading patented technology of new carbon nano materials and the world’s first new functional materials such as vertical graphene electrocatalytic electrodes, vertical graphene field emission electrodes and vertical graphene electric energy storage electrodes, which have broad application prospects.
The project will develop and aid in the research and production of liquid flow battery energy storage systems and their applications in the field of graphene and other various application areas.
COP Packaging Project Signed in Liangjiang New Area of Chongqing
The Liangjiang New Area of Chongqing City held an online ceremony to announce several major projects on August 18. 25 projects with a total investment of 46.3 billion yuan were signed, covering various strategic emerging industries and future industries such as automotive electronics, new energies, new materials, industry networks and chip designs, etc.
Chongqing Dayou Microelectronic Co. Ltd. invested 1.2 billion yuan to build a chip on PI (COP) packaging project in Liangjiang New Area. The project will build 30 COP packaging lines to achieve an annual capacity of over 1 billion camera chips.
Chongqing Dayou Microelectronics Co Ltd. took the lead in successfully developing the COP process in the global display chip packaging industry. Compared to traditional processes, the packaging efficiency was increased by 3 times, the test efficiency was increased by 4-20 times, and the labor required reduced by 4 times.
Established in 2020, Chongqing Dayou Microelectronics Co. Ltd. focuses on provides integrated circuit chip design services, integrated circuit design, manufacturing and sales.