Unigroup Chip City Construction Under Way
Construction has begun on the Unigroup Chip City project located in the Tianfu New Area of Chengdu. The project includes Unigroup Integrated Circuit (IC) Industrial Park and Unigroup IC Industry Research Institute, Unigroup Big Data Research Institute, Unigroup Smart City Research Institute, Unigroup Tianfu Industrial Cloud R&D Application Center, and Unigroup Industrial Cloud Sichuan Base.
The project has an investment of about 50 billion yuan and a total land area of about 2,000 acres. Expected to be put into operation in 2022, the facility will focus on development in ICs, big data, cloud computing and artificial intelligence (AI).
Hunan Invests 46 Billion Yuan in Industrial Park
Wuyi·Xinshijie Industrial Park is set to begin construction in Huaihua New-Tech Area, Hunan Province. The project will be an industry core area for semiconductor research, manufacturing and sales. Total planned investment is 46 billion yuan.
The first phase of the project will be divided into two sub-phases, each of which will take 3.5 years to complete. The first of these will comprise 112,000m2 of cleanrooms, four memory chip packaging test product lines and supporting facilities, with an investment of 22.45 billion yuan. The second sub-phase will include 340,000m2 of cleanrooms, 16 memory chip packaging test product lines and supporting facilities. Investment in this phase will total 27.6billion yuan.