Construction of the Suining Qifeng Intelligent Manufacturing Industrial Park Begins
The groundbreaking ceremony of Suining, Sichuan’s second major project in 2021, was held in the Suining Economy and Development Zone on September 6. There were 191 projects signed during the ceremony with a total investment of 53.25 billion yuan.
Suining Qifeng Intelligent Manufacturing Industrial Park was one of the projects signed during the ceremony. The total investment in the project is planned to be 1.45 billion yuan. The project will be integrated with the innovative functions of innovation and entrepreneurship incubation centers and supporting services, etc. and will primarily address high-tech industries such as electronic components, integrated circuit packaging, and testing. The project is expected to involve about 40 enterprises and create 4,000 jobs.
BOE to Invest In the Construction of Yandong Microelectronics’ Special Process 12-inch Integrated Circuit Production Line
BOE’s recent announcement details its plan to invest 1 billion yuan from its Tianjin BOE Innovation Investment Co. Ltd. subsidiary into Beijing Yandong Microelectronics Co. Ltd.
Yandong Microelectronics plans to build a special process 12-inch integrated circuit (IC) production line, with a plan to raise 4.5 billion yuan in funding.
Yandong Microelectronics currently has one 6-inch and one 8-inch chip production line using domestic equipment. The 8-inch production line is actively manufacturing using Trench-MOSFET, LD/PL-MOSFET, Trench-TVS, N-JFET, TMBS, and IGBT processes.
BOE stated in its announcement that this investment is to advance the construction of Yandong Microelectronics’ 12-inch chip production line which will use domestic equipment, and focus on verifying domestic equipment for use on large-scale production lines. Its goal is to improve the industrialization and market competitiveness of domestic equipment, improve equipment process control, form industrial cooperations between BOE and upstream chip designers and wafer manufacturers, and ensure the safety of chip capacity and key raw material supply.
Zhonghong Next Generation Infrared Compound Semiconductor Research Project Signed in Lingang
On September 8, Lingang New Area and Zhonghang Kaimai (Shanghai) Infrared Technology Co. Ltd. signed an investment agreement to jointly support the development of Zhonghang next generation infrared compound semiconductor research project.
Zhonghang Kaimai (Shanghai) Infrared Technology Co. Ltd. was established July 13, 2021 and is mainly engaged in the research and production of infrared detectors and optical components. It offers the leading research and production capacity of antimonide detectors in China.
Zhonghang Infrared has successfully entered the domestic civil high-end market based on consolidation of the existing market. Its new generation of products are widely used in forest fire prevention, medical equipment, and gas detection.
Integrated Circuit Project Signed in Xiamen
The signing ceremony for a number of major projects in the Fujian Province was held on September 8. Xiamen Anjieli Meiwei’s semiconductor packaging carrier research and manufacturing project, based in Haicang, was one of these projects.
The planned total investment will be 6.5 billion yuan and it will be built in two phases. The construction of Xiamen’s research headquarters and manufacturing facility is projected to finish during the 14th Five Year Plan period.
Established in 2019, Anjieli Meiwei is the leading enterprise for high-density interconnection technology and the largest integrated circuit packaging carrier in China. Its business scope includes optical electronic component manufacturing, printed circuit board manufacturing, integrated circuit manufacturing, etc.
Several Smart Sensor Projects Signed in Guangzhou
Guangzhou Huangpu District and Guangzhou Development Zone hosted the 2021 Guangdong-Hong Kong-Macao Greater Bay Area micro-nano sensor conference on September 8. Several smart sensor projects were signed, with a total investment of nearly 10 billion yuan.
There were eight key projects signed during the conference, including the Guangdong-Hong Kong-Macao Greater Bay Area micro-nano component innovation center, Donghua Software’s South China headquarters, Guangna Donghua’s nano perception joint venture project, Greater Bay Area’s virtual hybrid reality laboratory, Zimi, Guangdong Zhongxing’s intelligent national headquarters, Yunqian Technology’s digital headquarters, and a new generation of 5G smart hospitals.
Among these projects is Guangdong-Hong-Kong-Macao’s Greater Bay Area micro-nano component innovation center, a joint project of the Guangna Institute and Yuefang Technology (a subsidiary company of Henderson group). This project aims to build a service platform from micro nano components and build a gathering place for digital projects with micro-nano components as the core.
Meanwhile, the launching ceremony of the first intelligent sensor industrial park was held in Guangdong-Hong Kong-Macao Greater Bay Area. Both Guangdong intelligent sensor Industrial Park and Guangzhou Industrial Software Industrial Park ceremonies were held simultaneously. The total investment in the Guangdong Intelligent Sensor Industrial Park will be 2.68 billion yuan.