Semiconductor activity in China is continuing to grow at a rapid pace. Last week, two major projects worth billions of yuan officially kicked off, both of which are expected to be production-ready within a few years.

Read on for more details on those projects, as well as a few key project signing ceremonies.

Construction begins on Dianke Beifang IC Material Industrial Base project 

The commencement ceremony for major projects in Linzi District in Q2 was held on May 31 in Zibo City, Shandong. There were 25 projects featured in the ceremony, with a total investment of 18.79 billion yuan.

The most notable project underway is the Dianke Beifang IC Materials Industrial Base, which was originally signed on August 21, 2019. The base is going to be the first domestic IC material industrial base in Zibo City.

The base is expected to cover 4.4 million square meters and have three main parts: a semiconductor material park, a packaging and testing industrial park, and a comprehensive services park.

Following a two-year construction period, the base will be able to reach a 10-billion-yuan output capacity within five years.

Sino-Microelectronics kicks off plans to build power components base

The launch ceremony for the Sino-Microelectronics Advanced Power Device Packaging Base was held on May 30 in Jilin City. The base will extend the semiconductor power device industry chain by manufacturing advanced components and module packaging products.

With an investment of 2 billion yuan, the base is expected to have a total area of 110,000 square meters, a building area of 66,000 square meters, and an annual output of 1.5 billion advanced power devices.

The project will be built in three phases and is expected to be operational by the end of 2022.

High-tech production project signed in Suxitong Park

On June 2, Kunshan Liuerfeng Plastic Electronic Co., Ltd. signed an investment agreement with Suxitong Park worth 1 billion yuan.

Established in 1999, Liuerfeng is a high-tech enterprise that mainly manufactures new electronic components such as high-precision 4G and 5G communication products, high-precision audio devices and automotive precision products. The new project will help increase its production capacity. It is expected to reach full production in 2023, and generate annual sales up to 500 million yuan.

Liuerfeng is a supplier for global corporations including Honeywell, Nokia, Huawei and TCL.

Suzhou Guangju Semiconductor’s FBAR development project signed

The signing ceremony for Suzhou Guangju Semiconductor’s FBAR (thin-film bulk acoustic resonator) project was held in Xiangcheng on June 2.

The plan is to build a thin film bulk acoustic wave filter technology development and industrialization plant in the Suzhou Xiangcheng Economy Technology Development Zone. The total investment in the project will be 6 billion yuan.

Meng Fanbo, director of Suzhou Guangju Semiconductor, said that his R&D team is committed to breaking through the technical barriers and blockades in the area.

Plans signed for RMT’s headquarters in Suzhou High-Tech Zone

The signing ceremony for RMT Technology Group’s headquarters was held in the Suzhou High-Tech Zone on June 2.

It’s reported that in addition to the headquarters, RMT plans to build packaging and testing research institutes, R&D centers, packaging engineering technology centers, and marketing and sales centers, all in the Suzhou High-Tech Zone.

RMT is a design and manufacturing provider with key advanced packaging technologies and rich experience in project management and delivery. It focuses on providing one-stop solutions for advanced packaging and testing of high-end chips.