Last week’s China semiconductor news includes major projects signed in Hubei, Zhejiang province, Jiangxi province, and more! Read on to learn all about the most important projects signed last week.

 21 projects signed in Fuhe Modern Industrial Park

On July 23, 21 projects participated in a centralized signing ceremony for investment promotion projects at Fuhe Modern Industrial Park. The projects received a combined investment of 7.8 billion yuan.

Among the signed projects, six are related to optoelectronic display. The largest one is a display chip and ultra-wide color gamut solar screen production project from Shenzhen China Optoelectronics, which received a 2 billion yuan investment.

Another notable project signed was for Beihai Sanhe Optoelectronics, with a total investment of 800 million yuan, which will produce smart wearable glass and vehicle-mounted glass. Once the project is ramped into full production, it is expected to achieve an annual output of 20 million pieces of smart wearable glass and generate more than 350 million yuan in revenue.

Groundbreaking ceremony for new display manufacturing base held in Hubei

Ruihua Optoelectronics’ new display manufacturing base project officially began with a groundbreaking ceremony on July 24. The total investment of the project will be 5 billion yuan, with a total construction area of 270,000 square meters.

The first phase of the project will take 12 months and cost 1.5 billion yuan. It will consist of expanding full-color LED packaging capabilities, building a mini-LED backlight packaging production project, and a microLED technology researching project.

Once it’s fully operational, the annual capacity of the project will be 20 million mini-LED backlight packaging products.

Several compound semiconductor projects signed in Zhejiang Province

The signing ceremony of 10 major high-end manufacturing projects in Jiaojiang district, Taizhou, Zhejiang province was held on July 27. The projects were signed with a total investment of 22.7 billion yuan.

One notable project is a third-generation compound semiconductor chip project for silicon germanium and gallium arsenide. Guangzhou Oriental Nanyue Fund Management and China Second Metallurgical Group invested 10 billion yuan and 500 acres of land into the project. After completion, it is expected to garner 9 billion yuan in annual revenue.

A compound semiconductor substrate manufacturing project was also signed at the ceremony. With a total investment of 500 million yuan, the project will build 4 inch GaAs wafer production lines with an annual capacity of 2 million pieces, and 6 inch GaAs wafer production lines with an annual capacity of 1 million pieces.

6 projects signed in Jiangxi Province

The signing ceremony for six major projects in Longnan City, Ganzhou, Jiangxi province was held on July 28. The projects, which included a printed circuit board equipment manufacturing project and a carbon nano-tube project, received a total investment of 2 billion yuan.

The printed circuit board equipment manufacturing project received 300 million yuan from Universal Semiconductor Packaging Equipment. The project will be built in two phases and will mainly focus on the research, manufacturing and sales of circuit board equipment, automation system equipment, automation production lines and software.

The carbon nano-tube project is being funded by Ganzhou Haoxin New Energy, with a total investment of 200 million yuan. The project is expected to produce 20,000 tons of carbon nanotubes every year, which is expected to generate more than 600 million yuan in annual revenue.