Ningxia Xinjing new material quartz furnace expansion project signed in Yinchuan Economic Development Zone
Yinchuan Economic Development Zone and Zhejiang Jingsheng Electromechanical Co., LTD jointly held a signing ceremony for Ningxia Xinjing new material quartz furnace expansion project on August 12.
As an essential key consumable material in the photovoltaic and semiconductor industry, the quartz furnace is an essential basic material for producing semiconductor and solar single crystal materials.
The signed project is invested by Ningxia Xinjing New Material Technology Co., LTD with a total investment of 500 million yuan. It plans to build 24 furnace production lines. The project will be built in four phases. The project’s first phase plans to be in production by June 2023.
It’s introduced that Ningxia Xinjing New Material Technology Co., LTD is a wholly-owned subsidiary of Zhejiang Meijing New Material Co., LTD, a holding subsidiary of Zhejiang Jingsheng Electromechanical Co., LTD.
Established in 2006, Zhejiang Jingsheng Electromechanical Co., LTD is a leading domestic high-tech enterprise focusing on semiconductor material equipment and compound semiconductor substrate material manufacturing.
Shanghai Gona Semiconductor wafer transfer equipment project signed in Jiaxing
The whole module and key components project of Shanghai Gona Semiconductor wafer transfer equipment was signed and settled in Jiaxing Haining Economic Development Zone on August 15.
The total investment of the signed project is 230 million yuan, the investment in fixed assets is no less than 185 million yuan, and the total land area is about 40 mu. The new company will continue to comply with the semiconductor equipment and components’ localization trend and deepen and optimize the front-end module EFEM and wafer sorter of wafer transfer equipment. It will devote itself to the independent research and development of key components to promote and improve the localization of the industrial chain.
Established in 2020, Shanghai Gona Semiconductor Technology Co., LTD is a high-tech company focusing on R&D, production, and sales of wafer transfer equipment complete module (EFEM/WTS/sorter) and key components. The R&D teams are from well-known integrated circuit equipment enterprises at home and abroad.
Dingxin Microelectronics semiconductor chip packaging and testing project signed and settled in Changshu
Dingxin Microelectronics Semiconductor chip packaging and the testing project was officially signed and settled in Changshu Economic Development Zone Yangtze River Delta (Changshu) international advanced manufacturing industrial park recently.
It’s introduced that the project will build a 10,000 square meter clean plant, invest more than 100 million in advanced packaging equipment, and build a headquarters base integrating R&D and packaging testing.
Dingxin Microelectronics Technology (Taicang) Co., LTD was established in 2021 with a registered capital of 20 million yuan. The company’s business scope includes manufacturing of electronic components, integrated circuit chip and product manufacturing, sales of integrated circuit chips and products, integrated circuit manufacturing, integrated circuit sales, integrated circuit design, integrated circuit chip design, and service.
Huaxinwei semiconductor advanced packaging industrialization upgrading project signed in Xi’an High-Tech Zone
2022 Xi’an Industrial Investment Cooperation Annual Conference was held on August 15, and four industrial projects were signed in Xi’an High-Tech Zone.
Among them, Huaxinwei semiconductor advanced packaging industrialization upgrading project will further expand and improve chip design, testing, and reliability verification capabilities with advanced semiconductor packaging as the core. The project will be based on the current industry; the technical basis of highly reliable metal packaging, ceramic packaging, cermet packaging, hybrid integrated circuit packaging, and SIP packaging of Beijing Huaxinwei Semiconductor Co., LTD. It will take ‘chip last’ packaging technology and power SIP module as the development direction, establish an industrialization platform for 2.5D and 3D packaging, and build a highly reliable advanced packaging production line with an annual output value of 2 billion yuan.
Established in 2000, Beijing Huaxinwei Semiconductor Co., LTD is a large-scale manufacturer specializing in producing hybrid integrated circuits and multi-chip modules, mainly serving the oil industry, automotive electronics industry, medical machinery, and other industries.