Domestic first ‘blockchain + semiconductor equipment Industrial Park
Changsha County, Hunan Province, held a signing ceremony on April 20; 38 major industry projects were signed, with varying areas of focus from precision medical to semiconductor, intelligent chips to imported goods processing, and more.
Tianhe HuiGaoLian semiconductor industrial base project is China’s first “blockchain + semiconductor equipment Industrial Park” project. The project will cooperate with well-known universities such as the National University of Defense Science and Technology and Peking University. The focus is to tackle key technical problems in the park, introduce and cultivate high-end talent, strive for independent and controllable core patents in the fields of artificial intelligence and blockchain, and form a whole industrial chain. While simultaneously integrating research, production, sales, and settlement in the park.
The business scope of Hunan Tianhe HuiGaoLian Semiconductor Technology Co., Ltd. includes sales and installing semiconductor equipment, polymer materials, and related products, etc.
48 major projects signed in Hunan Province
In Changsha, Hunan Province, on April 19, 2022, a signing ceremony of major strategic projects occurred. There were 48 projects signed with a total investment of 120 billion yuan, covering intelligent manufacturing and new infrastructure.
iFLYTEK’s Hunan regional headquarter and intelligent manufacturing south-central headquarters project plans to set up a subsidiary company in Xiangjiang New Area as iFLYTEK’s Hunan regional headquarter and intelligent manufacturing south-central headquarter. The project will set up two core industries, including iFLYTEK artificial intelligence innovation institute and iFLYTEK Changsha artificial intelligence industry acceleration center, with a total investment of 500 million yuan.
Jinbo’s Changsha Semiconductor Industrial Park and carbon-based material industrialization research center will mainly construct the third-generation semiconductor silicon carbide high-purity carbon powder, high-purity silicon carbide powder, high-purity thermal field materials, and high-purity crystals. In addition, it will support production lines, carbon-based materials industrialization research center, pilot plants, and relevant supporting facilities. The project has a total investment of about 2 billion yuan.
Changsha Huike intelligent manufacturing industrial complex project has a total investment of about 5 billion yuan and a total area of about 500 mu. It will build a new Changsha Huike intelligent manufacturing industrial complex with the most complete upstream and downstream supporting display functional devices and the best industry complex in Changsha.
Compound semiconductor material and chip project signed in Yangzhou
Recently, the cloud signing ceremony of major projects was held in Baoying County of Yangzhou City, Jiangsu Province.
The compound semiconductor material and chip project was signed at the ceremony and planned to use its total investment of 2.21 billion yuan to settle in Baoying Development Zone.
The project is invested in and built by Shenzhen Zhongke Xinchen Technology Co Ltd in three phases.
Established in June 2021, Shenzhen Zhongke Xinchen Technology Co Ltd’s scope includes integrated circuit design and sales, electrical special equipment sales, semiconductor discrete components sales, etc.
First sensor chip industrial project signed in Wenling, Zhejiang Province
The signing ceremony of Zhejiang Laida Sensing Technology Co., Ltd.’s intelligent sensor chip and components manufacturing project was held on April 15.
The total investment in the project will be no less than 500 million yuan. The project will adopt vertical integration IDM mode to form a relatively complete IC industry chain from design, manufacturing, and packaging. It will test private brand sales and has important advantages in design and research, product quality, cost, and vertical integration.
It’s introduced that this project is the first sensor chip industrial project in Wenling City, Zhejiang Province.
Jiangsu Kehua’s new material EMC semiconductor packaging and testing material manufacturing project signed.
Jiangsu Kehua’s EMC intelligent manufacturing project was signed on April 13. The project is invested in and constructed by Jiangsu Kehua New Material Technology Co., Ltd. to build an intelligent production line with an annual capacity of 30,000 tons of EMC (epoxy plastic sealing material) on a plot of about 40 mu to the north of the existing plant of Kehua. They plan to build a new phase II plant, automatic warehouse, and 12 advanced packaging material production lines, mainly engaged in the research, production, and sales of EMC semiconductor packaging materials.