Grinm Semiconductor Materials Launches Wafer Production Line Project
Grinm Semiconductor Materials held an opening ceremony to launch construction of its large-size silicon wafer manufacturing facility in Dezhou, Shandong province. The 8 billion yuan deal was signed on July 26, 2018, and is separated into two phases: 1.8 billion yuan for the first phase, and 6.2 billion yuan for the second phase.
The first phase involves the construction of a 200mm Si wafer production line, with an annual capacity of 1.8 million wafers. The second phase involves the construction of a 300mm wafer production line with an annual capacity of 3.6 million wafers.
JingDing Nanjing Launches Project to Build Smart Manufacturing Value Chain Park
JingDing Nanjing has launched a project in the Pukou economic development area to build a smart manufacturing value chain park, with a focus on manufacturing high-end semiconductor equipment.
The total investment of this project will be 2 billion yuan and will cover the research and manufacture of semiconductor high-end equipment, smart manufacturing, machines, and components.
The project will be separated into two phases. The first phase will start in March 2019 and is expected to ramp to production by the end of the year.