Fudan Micro Plans China IPO

Shanghai Fudan Microelectronics is preparing for an initial public offering (IPO) of its stock. Fudan Micro has five mature product lines and system solutions, which include: security and identification; smart meters; nonvolatile memory (NVM); dedicated analog circuits; and field-programmable gate arrays (FPGAs). The security and identification products have been widely used for finance, city public transportation, electronic certification, mobile payment, and other applications. For smart meters, Fudan Micro developed a core microcontroller chip with independent intellectual property rights. NVM chips include Flash and EEPROM, for which the company holds China’s leading market share. Fudan Micro’s dedicated analog circuits are a range of high-performance leakage-protection chips, and the company has developed six generations of FPGA products.

Fudan Micro was founded in 1998, and went public in Hong Kong in 2000, becoming the first IC design company from mainland China to be listed on the Hong Kong Growing Enterprise Market. Today, Fudan Micro has more than 1,000 employees and annual sales of more than 1.4 billion yuan.

(Source: https://laoyaoba.com/newinfo?id=710359)

Midea and San’an Optoelectronics Set Up Third-generation Semiconductor Lab

Midea Group and Xiamen San’an IC Corp. will jointly set up a third-generation semiconductor lab, for which an unveiling ceremony was held on March 26.

The lab will research intelligent high-integration modules required for third-generation semiconductor power component chips and their system application, with an eye toward implementing them for white goods. The joint effort will focus on the development of gallium nitride (GaN) and silicon carbide (SiC) semiconductor power component chips and intelligent power module (IPM) application circuits. The lab will serve as a base for mutual collaboration and technology research.

Midea is a leading provider of consumer appliances, while San’an IC is well established as a leader in compound semiconductor manufacturing and owns China’s first 6-inch compound semi wafer fab. The joint effort will enable the two companies to leverage each other’s market position to integrate third-generation semiconductors into advanced electronic white goods.

(Source: https://laoyaoba.com/newinfo?id=710346)