CSMC Announces 0.18µm Full-range Sectional BCD Process Platform
Wuxi CSMC Technology Corp. announced the development of a 0.18µm BCD process platform with full range sectional voltage. The company provides solutions with and without epitaxial processes. The platform enables industry-leading performance advantages including small design rules and on-resistance, good mismatch features, rich library units and IP options, etc. The platform targets wearable devices, mobile phone, PC, small home appliances, medical products, and more.
The 0.18µm BCD process platform can provide 6-voltage segments: 7V-16V, 18V-20V, 24V-30V, 35V-40V, 40V-60V, 80V-120V, and also rich parasitic components such as BJT, Poly resistance, Zener, SBD, and ESD protection solutions for different working voltages.
Shanghai Pushes the Development of SMIC and HLMC
SMIC is building up its 300mm chip production line for next-generation high-end communications and consumer electronics products, with a total investment over $10 billion. Upon completion, it will become the most advanced chip manufacturing fab in China.
HLMC Phase II was built to tip-out last October, launching 28nm chip manufacturing, with plans to ramp into production at the end of 2022. The 14nm process production line will increase the monthly capacity from 10000 to 40000.
Last November, EDO’s sixth generation flexible AMOLED production line successfully launched, with the total investment 27.278billion. The monthly capacity will be 30000 glass substrates (1500mm x 1850mm) and 1-15inch display screens and modules (some are flexible).
The total area of the factory is about 390000m2, 320000m2. It houses the largest cleanroom in Shanghai.