Maxscend IPO Approved

Jiangsu Maxscend Electronics announced that it has successfully passed the auditing for its initial public offering (IPO) application on May 16. It plans to issue no more than 25million new shares.

Maxscend hopes to raise 1.2 billion yuan with its IPO, which will be used for various projects designated as follows:

  • Radio frequency (RF) wave filter chip and module development and industrialization (470 million yuan)
  • RF power amplifier chip and module development industrialization (250 million yuan)
  • RF switch and low noise amplifier (LNA) technology upgrade and industrialization (170 million yuan)
  • Development and industrialization of a connectivity microcontroller unit (MCU) for IoT applications (180million yuan)
  • Development center project and (140million yuan)

Maxscend is an integrated circuit design company that was founded in 2012. It primarily researches, develops, and sells RF front-end chips, and provides RF front-end products such as RF switches, RF low-noise amplifier, etc., The company also provides IP for smart mobile applications like a smartphone. Currently, Maxscend products are used by Samsung, Xiaomi, Huawei, Vivo, TCL, etc.


Trulyopto Moves Forward with High-End Display Project

Trulyopto and the Renshou District government of Meishan City, Sichuan Province, signed an agreement on May 16 to launch construction of an integrated touch module and mini camera module manufacturing facility. The total investment of this project will be 2.5billion yuan. Construction begins in May 2019 and will be completed in 2021.

According to a report from Renshou District Government Net, this facility will support an ongoing high-end display project that kicked off in July 2017 with a total investment of 12.5billion yuan.

Trulyopto focuses on developing, manufacturing and selling capacitive touch, mini camera module and integrated touch module products widely used in internal and external companies’ mobile phone, consumer electronics, industry, and medical products.