5G Chip and IC Packaging Project Signed in Jingmen

Jingmen of Hubei Province and Shenzhen East-Link held a signing ceremony for a semiconductor chip and integrated circuit (IC) packaging project focused on IC packaging and test of 5G optoelectronic chips.

The total investment of this project is 500million yuan, which will fund the construction of a semiconductor packaging & test line in Dongbao Electronic Information Industry Park for 5G chip packaging and test. The annual capacity will be 130million units after the project ramps into production.

Established in June 2015, Shenzhen East-Link focuses on the packaging of 5G optoelectronic chips. It uses 5G communication chip packaging technology and independently researched manufacturing equipment. Its products are applied in mobile communication, optical fiber communication, and IoT.

(Source: https://laoyaoba.com/newinfo?id=716238)

5G RF Front-end Start-up, Radrock, Completes A-Round Financing

Radrock recently announced that it has completed it’s A-round financing of ten million yuan. This final round was preceded by two rounds of financing in May 2017 and August 2018.

Founded in April 2017 by students from Silicon Valley, Radrock focuses on researching and selling high-performance, high-value-added mobile phone RF front-end products to meet domestic mobile phone companies requirements for RF front-end products needed to accommodate the next ten years of China’s 4G, 5G and IoT markets.

Radrock plans to use this round financing for researching domestic high-performance RF components for 5G, as well as marketing and operations to further improve product competitiveness and its brand value.

It is reported that Rodrock’s “RF front-end testing system for 5G” has passed the technology validation of national wireless test center and they will launch LET HPUE and 5G N41 products in Q2, 2019. Additionally, Rodrock will announce a new series of high-performance 4G, 5G  and RF front-end products in the second half of 2019.