Bosch Signs Project for MEMS, Sensors and Chip Testing Center

During the second Jiangsu Development Conference, held in Suzhou on May 21, 2019, Bosch Automobile Parts’ MEMS, sensors and semiconductor chip testing center was one of 15 important projects signed. The investment for all the projects totaled 17.2billion yuan.

Established in 1999, Bosch Automobile Parts (Suzhou) Corp. has three factories and two office buildings with multiple divisions comprising automotive electronics, chassis system control, auto multimedia, Bosch smart manufacturing solutions, and Bosch interconnection industry, etc. The new center will expand Bosch’s investment in emerging areas like IoT, AI, etc.


Shanghai Reports 2018 IC Revenues of 145billion Yuan

According to a Shanghai Government News Department press briefing held May 21, 2019, the Shanghai integrated circuit (IC) industry revenue for 2018 reached 145billion yuan. This represents one-fifth of China’s overall IC revenue.

In IC design news, it was announced that UniSoc ranks third globally in market share of its mobile baseband chip is world No.3. Additionally, some companies report they have research capability for designing 7nm chips.

In manufacturing, SMIC and Huahong Group are the reported leaders in China. In the equipment and materials sector, leaders are AMEC and SMEE. Overall, the 28nm advanced process has ramped into production, and R&D for 14nm processes is almost complete.

Future development plans for Shanghai will focus on three core technologies including ICs, AI, and biomedicine, to build a world-leading industry cluster.

Shanghai Jita Semiconductor Holds Production Line Roofing Ceremony

The workshop roofing ceremony of Jita Semiconductor special process product line project was held in Shanghai on May 21, 2019. The first big industry project to be settled, it is an important part of the collaboration agreement between the Shanghai Government and China Electronics Corporation.

The goal of the project is to build an 8-inch production line with a monthly capacity of 60,000 wafers, and a 12-inch special process production line with a monthly capacity of 50,000 wafers to serve high-end applications like industrial control and automotive electronics. Equipment installation is planned for the end of 2019, with the ramp to production to follow shortly thereafter. The total investment of this project is 35.9billion yuan.