Montage Technology Launches IPO

Montage Technology reports that it has prepared for its IPO. Montage Technology is a fabless semiconductor company that provides mainly high-performance IC-based solutions for cloud computing and AI markets. Established in 2004, the company is headquartered in Shanghai, and has branches in Kunshan; Macao; Silicon Valley, USA; and Seoul, South Korea.

With more than 10 years dedicated to developing memory interface technology, the company is the only vendor delivering fully  and partially buffered solutions from DDR2 to DDR5. The company’s DDR4 fully buffered “1+9” distributed architecture was adopted by JEDEC as an international standard, and its related products have successfully entered the industry mainstream memory, server and cloud computing fields, and serve the majority of the global market.

(Source: https://mp.weixin.qq.com/s/MXaGw0_LboWfmKINQTz_mg)

IC Special Process and Packaging & Test Alliance Established

United Microelectronics Center (UMC), along with over 50 companies and research institutions from the entire industry supply chain, announced the establishment of the China IC Special Process and Packaging and Test Alliance in Chongqing. The alliance will consolidate related resources from wafer foundries, packaging fabs, pilot lines, etc., to cover the entire industry supply chain including materials, components, processes, and equipment.

This is the first industry alliance of its kind in China. UMC organized the alliance. The initial members include 50 companies, institutions, research centers, and investment agencies including CR Micro, Chang’an Auto, China Key System, Shanghai Jiaotong University, Beijing Institute of Technology, etc.

Source: (https://laoyaoba.com/newinfo?id=703613)