China is continuing to show its commitment to growing its semiconductor and integrated circuit industries, as dozens of more projects were signed this week. The projects, including three in the Guangdong province, are being backed by investments worth billions of yuan.

Keep reading for an in-depth look into the major semiconductor projects and signing ceremonies from last week.

Three semiconductor projects signed in Guangdong province

On May 21, Dongguan City, Guangdong, held a strategic conference to promote investments in emerging industries.

Numerous projects were signed at the conference with a total investment of 148.3 billion yuan, spanning many different industries.

The three semiconductor-related projects include a smart technology manufacturing project from Guangdong LY iTECH, an advanced packaging project from Nexperia, and an intelligent driving and energy R&D project from Dongguan Zhengyang Electronic Mechanical.

The three projects received a total investment of 4.6 billion yuan.

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10 industrial projects signed in Nanjing

The China IC Unicorn CEO Summit and IC Industry Development Conference of Jiangning Development Zone was held on May 25.

At the meeting, 10 new industrial projects were signed, including chip research and development, design, packaging and testing, and semiconductor materials and equipment. The goal is to boost the development of the integrated circuit industry in the Jiangning Development Zone.

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Semiconductor project gets 800 million yuan investment

The Tuopu Semiconductor’s RF Chip Rare Earth Targeting Materials Project was greenlit on May 24 at a signing ceremony in Huizhou Tonghu Ecological Smart Zone.

The project was founded by Huizhou Tuopu Metal Materials Co. Ltd., with a total investment of 800 million yuan.

It will focus on researching, manufacturing and selling rare earth targeting materials for semiconductor RF chips, high-strength light structural alloy materials, and welding wire.

Huizhou Tuopu Metal Materials Co., Ltd., which was established in 1993, is a national high-tech enterprise that develops and produces various nonferrous metals, alloys, various sputtering targets, and functional materials.

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Construction began on a high-performance material project

The Dongtai Municipal Party Committee and the municipal government of Yancheng, Jiangsu province, held a ceremony commencing the start of the Lingsheng 3C series on May 26.

The plan is to build 350,000 square meters of plants and supporting facilities using industrial sensors, industrial robots and other smart equipment. The focus will be on researching and manufacturing a new generation of soft magnetic materials, consolidating the leading position of precision module manufacturing, and actively expanding the production and manufacturing of keyboards, chargers and other terminal products.

Triumph Lead Group, a leading manufacturer of high-precision small parts, invested 5 billion yuan in the project.

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Aoshikang Electrical information industry base project signed

In a signing project in Zhaoqing New District on May 25, nine projects, including the Aoshikang Electrical Information Industry Base, were signed.

The investment in the Aoshikang Electrical Information Industry Base is about 1 billion yuan, including an equipment investment of 400 million yuan.

The funds will mainly be used to build high-standard industrial plants and introduce upstream and downstream enterprises in the printed circuit board industry chain.

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