Semiconductor activity continues to flourish across China, as last week, five high-end chip projects were signed in Suzhou, smart display module and power semiconductor projects were agreed to in Henan Province, and a semiconductor company signed a contract to build its headquarters in Shanghai. Read about those projects and more below!

 5 high-end chip projects signed in Suzhou

A signing ceremony for five high-end chip projects in Taicang, Suzhou, was held on July 30. The projects have received a total investment of 1.4 billion yuan.

The biggest project signed was the Zongchung Electronic Components and Equipment Project, which will mainly engage in the research, development and manufacturing of circuit boards and other electronic components and equipment. It received a total investment of 1 billion yuan and is expected to generate over 600 million yuan in annual revenue.

The next biggest project was the Xingbang Smart Chip Project, which received an investment of 300 million yuan to produce leading digital electronic detonator technology and equipment.

Smart display modules and power semiconductor projects signed in Henan province

The government of Shihe District, Xinyang City, Henan province signed a two-project cooperation agreement with GMA Optoelectronic Company and Jinshang Semiconductor dealing with smart display modules and power semiconductors.

As part of the agreement, Gumai Optoelectronics will invest in building new small and medium-sized smart display production lines and supporting facilities. The annual capacity is expected to be 200kk smart display modules once the project ramps into production.

Jinshang Semiconductor will invest in the power semiconductor project, which consists of building a comprehensive office building, joint plants and ancillary facilities, and which will introduce 300 power semiconductor packaging and testing production lines. The annual capacity will be 250,000kk power semiconductor light sources after the project ramps into production.

Semiconductor company to build headquarters in Shanghai

Jiangsu Damo Semiconductor Technology has announced it will build its headquarters and a researching and manufacturing base in Songjiang, Shanghai. The total investment in the project will be about 172 million yuan.

Established in 2017, Jiangsu Damo Semiconductor Technology mainly remanufactures integrated circuit and semiconductor wafer inspection equipment and provides other technological services. Their customers include TSMC and SMIC.

Groundbreaking ceremony for 2.3 billion yuan industrial park held in Anhui province

Sixteen projects were kicked off at a groundbreaking ceremony in Ma’anshan, Anhui province on July 31. The most notable project was Shenzhen Science and Technology Industrial Park, which received a total investment of 2.3 billion yuan from Shenzhen Shenye Group.

The project involves collecting high quality industrial science and technology resources in the Yangtze and Pearl River Deltas. It will focus on developing new industries, such as electronic information and smart manufacturing.

Dongxu Group’s high tech materials project signed in Rizhao

Shandong Rizhao Economic Development Zone signed an agreement with Dongxu Group on Aug. 3 for a high tech materials project.

The total investment of the project, which will be built in three phases, is 10 billion yuan.

Dongxu is one of China’s top 500 private enterprises, and its business areas include optoelectronic display materials, high-end equipment and new energy vehicles. Rizhao Municipal Party officials hope the project will help the city with innovation and economic development.