Last week’s China semiconductor news included a new special circuit board project, an advanced semiconductor process equipment project, and six projects in Jiangxi Province with a combined 10.5 billion yuan in funding. Read about those projects and more below.

 Semiconductor power module project signed in Nanjing

The Nanjing Economic and Technological Development Zone entered into a strategic partnership with Danfoss Group of Denmark on June 25 to produce semiconductor power modules. The project received an investment of 100 million euros, which is equivalent to more than 750 million yuan.

Construction is expected to begin in 2022, with production expected to start at the end of 2023.

Once it’s operational, the annual capacity of a single production line—which will be equipped with cutting-edge technology—will be 2.5 million power modules. The modules will be used for environmentally friendly industries and products like rail transit, smart grids, electrical vehicles and new energy equipment.

Project to produce high-layer and special circuit boards announced

On June 26, Bomin Electronics announced a project to invest in and expand the production of next-gen electronic circuit boards. The expansion project will be located in Dongsheng Industrial Park in the Meijiang District of Guangdong Province.

Over 3 billion yuan was invested in the project, which will mainly be used to manufacture products such as high multilayer boards, rigid-flex boards and special boards. The estimated output is expected to be more than 3.6 million square meters per year.

The project is expected to finish its first phase in three years and be fully operational in five years.

Six major projects signed in Jiangxi Province

The signing ceremony for six major projects that received a combined 10.5 billion yuan in funding was held in Longnan City, Jiangxi Province on June 28.

One of the projects was an optical material manufacturing project that received 1 billion yuan to produce optoelectronic products and 5G materials.

Another project, signed by Shenzhen Xinlongye Electronic Technology, received 1 billion yuan to research, manufacture and sell aluminum-based copper laminate. When it’s fully operational, revenue from the project is expected to exceed 1 billion yuan per year.

Advanced semiconductor process equipment project signed in Changshu

A signing ceremony in Guli Town, Changshu, was held last week to promote a project dedicated to the research, development and mass production of advanced semiconductor process equipment.

The project, from Suzhou Shengfeng Electronic Technology, received an investment of 550 million yuan. The project is expected to generate an annual output of 300 million yuan, which will produce 20 million yuan in annual tax revenue.

Semiconductor chip packaging and testing project announced in Yundonghai

A semiconductor chip packaging and testing project was signed to settle in the Yundonghai Electrical Information Industrial Park in the Fogao District on July 1.

The reported investment for the project is 760 million yuan, which will be used to build an R&D and production center, a key lab and an exhibition center. A strong, technologically sound research team will then begin the researching, production and sales of packaging and testing semiconductor chips.