Last week’s semiconductor news in China included a high-end equipment project signed in Anhui Province, 12 new semiconductor projects signed in Yiwu, and an OLED display laser project in Chongqing. Read on for more information about those projects and more.
High-end equipment project singed in Anhui Province
The signing ceremony of Hefei Shengli Microelectronics Technology’s high-end semiconductor equipment manufacturing project was held in the Juchao Economic Development Zone on July 5.
The project received an investment of 520 million yuan and 36 acres of land from Suzhou Licarbon New Energy Development. The goal of the project is to manufacture material plastic equipment, 3D additive heat treatment equipment, and additive testing equipment.
Hefei Shengli Microelectronics Technology was established in June 2021. Its business scope includes special electronic materials researching, production of additive manufacturing equipment, production of intelligent basic manufacturing equipment, production of semiconductor components special equipment, integrated circuit designing, and more.
OLED display laser equipment project signed in Chongqing
The “Chongqing College of Arts and Sciences OLED Flexible Display Laser High Frequency Cutting Equipment Production Project” was signed on July 6 at the 2021 Chongqing Science and Technology Achievement Transfer Summit.
The agreement, signed by Chongqing Yongchuan District and Ningbo Kafeimu New Material Co., Ltd., stipulates that the two sides will cooperate in researching, developing, producing, operating, and promoting OLED display laser equipment and optical comb precision inspection equipment.
Energy electronic components project signed in Qingdao
The signing and groundbreaking ceremony of New Focus Optoelectronics Technology’s new energy electronic components project was held in Laixi City of Qingdao, Shandong Province on July 6.
The project, located in Qingbei High-Tech Park, received an investment of 1 billion yuan to build a new energy electric component production base and a new energy technology research and development center, which will focus on smart vehicles and unmanned driving. The total planned building area will cover 180,000 square meters.
Projects to build semiconductor chip industry chain system signed in Yiwu
At an investment promotion signing ceremony in Yiwu City on July 7, 22 projects with a combined investment of 61.93 billion yuan were signed. Among those projects, 12 were industrial products focusing on building a semiconductor chip industry chain system.
The signed projects include:
- The Yiwu Semiconductor Industry Fund of Funds project, which will coordinate major companies in the semiconductor industry with Yiwu Industrial Investment Development Group to jointly invest.
- The Ruitest Semiconductor Project, which will produce packaging and test equipment and wafer test equipment used to produce image sensors.
- The Flender 5G Optoelectronics New Material Project, which will build a 5G optoelectronics new material production base with an annual output of 90,000 tons.
- The Rena Silver Paste Project, which will use 40 acres of land to build a base to produce photovoltaic and semiconductor silver paste.
New material industrial park signed in Harbin
The Harbin government signed a strategic collaboration agreement with Ningbo Jiangfeng Electronic Materials and Tongchuang Purun Mechanical and Electrical High-Tech on July 4.
As part of the agreement, 2.5 billion yuan will be invested to build a new material industrial park. The project will consist of a leading ultra-high-purity metal material innovation and manufacturing base and a world-class ultra-high-purity metal material analysis and testing technology center.