Jiangsu Guozhongxin semiconductor chip packaging and testing project signed in Hubei Province

The chip packaging and testing project of Jiangsu Guozhongxin Semiconductor Co., Ltd. was signed and settled in Xianning City, Hubei Province, on March 17.

It is the first semiconductor manufacturing enterprise introduced in the Tongcheng District of Xianning City. According to the agreement, the project’s total investment is 1.078 billion yuan. The project will be built in two phases. The investment in the first phase will be 510 million yuan, while the second phase will be 568 million yuan.

The project involves building 20,000 square meter plants, 15 high-end chip packaging, and testing production lines. Construction of the project begins within 40 days, and the plant will be in production by September.

Jiangsu Guozhongxin Semiconductor Co., Ltd. is an enterprise specializing in research, production sales, and service of integrated circuits, LED component packaging, and products.



Shanghai Tianyue’s SiC semiconductor material project roofed

It’s reported that the Shanghai Tianyue SiC semiconductor material project was approved with an investment of 2.5 billion yuan.

Located in Pudong New Area, Shanghai, with a total construction area of about 95,000 square meters, the project mainly includes building production plants, power plants, a hydrogen station, a special gas station, a chemical warehouse, and a 110KV substation.

Once complete, the project will produce 6-inch conductive SiC semiconductor material, which will be applied to new energy vehicles, transportation, and high-power transmission and transformation. The annual capacity of the project will be 26,000 conductive SiC ingots and 300,000 substrate projects.

Founded in 2010, Shanghai Tianyue is engaged in researching the production and sales of wide bandgap semiconductor (third-generation semiconductor) silicon carbide substrate materials. Its products can be used in microwave electronics, power electronics, and other fields. Its main products include semi-insulating and conductive silicon carbide substrates.



project of Green Transformation Industry Senyang Electronic semiconductor packaging project signed in Sichuan Province

Renhe District, Panzhihua City, Sichuan Province, held the ‘cloud signing’ ceremony of the ‘green transformation industry’ key investment projects in 2022 on March 10. Eight projects, including Senyang Electronic Technology integrated circuit (IC) semiconductor packaging, were signed at the ceremony with a total investment of 10 billion yuan.

Senyang Electronic’s IC semiconductor packaging project involves intelligent manufacturing, research, and production for semiconductor packaging lines. Its plans to expand to optoelectronic device products to complete an optoelectronic industry chain.


47 projects started construction and were signed in Zhejiang Provincecloud signing activity for major projects in the first quarter of 2022

The signed projects include Jingsheng research center (Hangzhou), i.e., semiconductor intelligent equipment manufacturing base project, semiconductor power driver, module and testing equipment project, Guangzhou Guangsu optical communication module core components project, Xintang Technology vector sensing module research and development project, etc.

Jingsheng researching center (Hangzhou), i.e., an intelligent semiconductor equipment manufacturing base project, is invested by Zhejiang Jiangsheng Electromechanical Co., Ltd. with a total investment of 1.03 billion yuan.

Listed in 2012, Zhejiang Jiangsheng Electromechanical Co., Ltd. is a leading domestic high-tech enterprise that manufactures semiconductor materials and equipment and LED substrate materials.

Fangshide Technology Co., Ltd. invested in the semiconductor power driver, module, and testing equipment project. Feishide Technology Co., Ltd. is researching the production and sales of overall solutions for semiconductor power units and has successfully applied intelligent drives to new energy vehicles and transportation.

Guangzhou Guangsu, an optical communication module core component project, is invested by Guangzhou Guangsu Information Technology Co., Ltd. The project will build a core device preparation production line, researching experimental field, and production and sales center.

Guangzhou Guangsu Information Technology Co., Ltd. is a national high-tech enterprise focusing on the intelligent management of optical fiber network, research, and the application of optical fiber communication and sensing technology.