Yinhe Semiconductor’s IC Silicon Wafer Project Ramps to Production

Yinchuan Daily reports that phase-two construction of Yinhe Semiconductor’s large IC silicon wafer project is complete, and the facility will ramp to production in July.

The total investment of this project will be 1.6 billion yuan, with expected revenue of 1 billion yuan. The annual capacity of 4.2 million 200mm silicon wafers and 2.4 million 300mm silicon wafers will target industries such as electronics, semiconductors, communication, automobiles, medical, national defense, etc.

(Source: https://mp.weixin.qq.com/s/jOAKNL4vHH8e21ImSc4EPg)

Shandong Tianyue SiC Power Chip Project Launched

Shandong Tianyue’s silicon carbide (SiC) MOSFET chip development and industrialization project was officially launched on February 27, 2019. The facility is expected to run at 4 million SiC MOSFET capacity.

The project is one of the important projects in Jinan in 2019. Its total investment is 6.5 million yuan, the total area of the factory will be 2400m2, and will mainly consist of one SiC MOSFET production line and another SiC electric vehicle driver module production line.

(Source: https://laoyaoba.com/newinfo?id=707343)

Silan Microelectronics Introduced High-accuracy MEMS Si Microphone Series

After 3 years in development, Hangzhou Silan Microelectronics’ Si microelectromechanical systems (MEMS) microphones recently ramped into production. It’s specially designed for the fast-growing consumer market and can be used in smart sound boxes; a variety of headphones including TWS, Bluetooth, noise cancellation, and smart headphones; as well as PCs, digital video recorders, smart remote controllers, IP cameras, and more.

This high-performance, omnidirectional Si MEMS microphone features high uniformity and low power consumption. It uses miniature non-pin SMD packaging and comes in a range of sizes including 3.76mm, 2.95mm, 1.10mm, 3.76mm, 2.24mm, 1.1mm and 2.75mm, 1.85mm, 0.90mm, etc.

(Source: https://laoyaoba.com/newinfo?id=707301)